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Editorial Board

IJDATICS

International Journal of Design, Analysis and Tools for Integrated Circuits and Systems


Editor-In-Chief 

Ka Lok Man
Xi’an Jiaotong-Liverpool University, China and
Baltic Institute of Advanced Technologies, Lithuania

 

Assistant Editor-In-Chief

David Afolabi
Xi’an Jiaotong-Liverpool University, China
 


Managing Editor 

Michele Mercaldi,
EnvEve, Switzerland

Kaiyu Wan,
Xi’an Jiaotong-Liverpool University, China

Tomas Krilavičius,
Baltic Institute of Advanced Technologies, Vytautas Magnus University, Lithuania
 


Journal Secretary 

Jun Wang,
Fujitsu Laboratories of America, Inc., USA


Linguistic Editor 

Nigel Julian Dixon,
Xi’an Jiaotong-Liverpool University, China

Caren Crowley,
Katholieke Universiteit Leuven, Belgium



Associate Editor 

Chao Lu
Arctic Sand Technologies Inc. Cambridge, MA, US


Hai-Ning Liang
Xi’an Jiaotong-Liverpool University, China


Mou Ling Dennis Wong
Swinburne University of Technology, Malaysia

 

Editorial Board

  • Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
  • Paolo Prinetto, Politecnico di Torino, Italy
  • Massimo Poncino, Politecnico di Torino, Italy
  • Alberto Macii, Politecnico di Torino, Italy
  • Joongho Choi, University of Seoul, South Korea
  • Wei Li, Fudan University, China
  • Michel Schellekens, University College Cork, Ireland
  • Emanuel Popovici, University College Cork, Ireland
  • Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
  • Umberto Rossi, STMicroelectronics, Italy
  • Franco Fummi, University of Verona, Italy
  • Graziano Pravadelli, University of Verona, Italy
  • Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong
  • Ajay Patel, Intelligent Support Ltd, United Kingdom
  • Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, The Netherlands
  • Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
  • Monica Donno, Minteos, Italy
  • Jun-Dong Cho, Sung Kyun Kwan University, South Korea
  • AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
  • Gregory Provan, University College Cork, Ireland
  • Miroslav N. Velev, Aries Design Automation, USA
  • M. Nasir Uddin, Lakehead University, Canada
  • Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
  • Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
  • John Herbert, University College Cork, Ireland
  • Zhe-Ming Lu, Sun Yat-Sen University, China
  • Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
  • Chin-Chen Chang, Feng Chia University, Taiwan
  • Mong-Fong Horng, Shu-Te University, Taiwan
  • Liang Chen, University of Northern British Columbia, Canada
  • Chee-Peng Lim, University of Science Malaysia, Malaysia
  • Salah Merniz, Mentouri University, Constantine, Algeria
  • Oscar Valero, University of Balearic Islands, Spain
  • Yang Yi, Sun Yat-Sen University, China
  • Damien Woods, University of Seville, Spain
  • Franck Vedrine, CEA LIST, France
  • Bruno Monsuez, ENSTA, France
  • Kang Yen, Florida International University, USA
  • Takenobu Matsuura, Tokai University, Japan
  • R. Timothy Edwards, MultiGiG, Inc., USA
  • Olga Tveretina, Karlsruhe University, Germany
  • Maria Helena Fino, Universidade Nova De Lisboa, Portugal
  • Adrian Patrick ORiordan, University College Cork, Ireland
  • Grzegorz Labiak, University of Zielona Gora, Poland
  • Jian Chang, Texas Instruments, Inc, USA
  • Yeh-Ching Chung, National Tsing-Hua University, Taiwan
  • Anna Derezinska, Warsaw University of Technology, Poland
  • Kyoung-Rok Cho, Chungbuk National University, South Korea
  • Yuanyuan Zeng, Wuhan university, China
  • D.P. Vasudevan, University College Cork, Ireland
  • Arkadiusz Bukowiec, University of Zielona Gora, Poland
  • Maziar Goudarzi, Sharif University of Technology, Iran
  • Jin Song Dong, National University of Singapore, Singapore
  • Dhamin Al-Khalili, Royal Military College of Canada, Canada
  • Zainalabedin Navabi, University of Tehran, Iran
  • Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
  • Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan
  • Deepak Laxmi Narasimha, University of Malaya, Malaysia
  • Danny Hughes, Katholieke Universiteit Leuven, Belgium
  • A.P. Sathish Kumar, PSG Institute of Advanced Studies, India
  • N. Jaisankar, VIT University. India
  • Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan
  • Steven Hollands, Synopsys, Ireland
  • Siamak Mohammadi, University of Tehran, Iran
  • Felipe Klein, State University of Campinas (UNICAMP), Brazil
  • Enggee Lim, Xi’an Jiaotong-Liverpool University, China
  • Kevin Lee, Murdoch University, Australia
  • Prabhat Mahanti, University of New Brunswick, Saint John, Canada
  • Tammam Tillo, Xi’an Jiaotong-Liverpool University, China
  • Yanyan Wu, Xi’an Jiaotong-Liverpool University, China
  • Wen Chang Huang, Kun Shan University, Taiwan
  • Masahiro Sasaki, The University of Tokyo, Japan
  • Shishir K. Shandilya, NRI Institute of Information Science & Technology, India
  • J.P.M. Voeten, Eindhoven University of Technology, The Netherlands
  • Wichian Sittiprapaporn, Mahasarakham University, Thailand
  • Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA
  • Kevin Marquet, Verimag Laboratory, France
  • Matthieu Moy, Verimag Laboratory, France
  • Ramy Iskander, LIP6 Laboratory, France
  • Suryaprasad Jayadevappa, PES School of Engineering, India
  • Shanmugasundaram Hariharan, Pavendar Bharathidasan College of Engineering and Technology, India
  • Chung-Ho Chen, National Cheng-Kung University, Taiwan
  • Kyung Ki Kim, Daegu University, Korea
  • Shiho Kim, Chungbuk National University, Korea
  • Hi Seok Kim, Cheongju University, Korea
  • Brian Logan, University of Nottingham, UK
  • Asoke Nath, St. Xavier’s College (Autonomous), India
  • Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand
  • Shin-Ya Takahasi, Fukuoka University, Japan
  • Cheng C. Liu, University of Wisconsin at Stout, USA
  • Farhan Siddiqui, Walden University, Minneapolis, USA
  • Katsumi Wasaki, Shinshu University, Japan
  • Pankaj Gupta, Microsoft Corporation, USA
  • Masoud Daneshtalab, University of Turku, Finland
  • Amit Chaudhry, Technology Panjab University, India
  • Bharat Bhushan Agarwal, I.F.T.M., University, India
  • Abhilash Goyal, Oracle (SunMicrosystems), USA
  • Boguslaw Cyganek, AGH University of Science and Technology, Poland
  • Yeo Kiat Seng, Nanyang Technological University, Singapore
  • Youngmin Kim, UNIST Academy-Industry Research Corporation, South Korea
  • Tom English, Xlinx, Ireland
  • Nicolas Vallee, RATP, France
  • Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA
  • Xuan Guan, Freescale Semiconductor, Austin, TX, USA
  • Pradip Kumar Sadhu, Indian School of Mines, India
  • Fei Qiao, Tsinghua University, China
  • Ding-Yuan Cheng, National Chiao Tung University, Taiwan
  • Shin-Il Lim, Seokyeong University, Seoul Korea
  • Pradeep Sharma, IEC College of Engineering & Technology, Greater
  • Noida, GB Nagar UP, India
  • Ausra Vidugiriene, Vytautas Magnus University, Lithuania
  • Sheung-Hung Poon, National Tsing Hua University, Taiwan
  • Lixin Cheng, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
  • Yue Yang, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
  • Yo-Sub Han, Yonsei University, South Korea
  • Chien-Chang Chen, Tamkang University, Taiwan
  • Hui-huang Hsu, Tamkang University, Taiwan
  • Hwann-Tzong Chen, National Tsing Hua University, Taiwan