DATICS-IS3C 2014

DATICS Workshops were initially created by a network of researchers and engineers both from academia and industry in the areas of Design, Analysis and Tools for Integrated Circuits and Systems. Recently, DATICS has been extended to the fields of Communication, Computer Science, Software Engineering and Information Technology. The main target of DATICS-IS3C 2014 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all aspects of DATICS.

DATICS-IS3C 2014 will be hosted by the 2014 International Symposium on Computer, Consumer and Control which will take place in Taichung City, Taiwan on June 10-12, 2014. This conference offers a great opportunity for scientists, engineers, and practitioners to present the latest research results, ideas, developments, and applications, as well as to facilitate interactions between scholars and practitioners. The URL of the conference is: http://is3c2014.ncuteecs.org/.


TOPICS

Topics of interest include, but are not limited to, the following:

Circuits, Systems and Communications:

  • Design, Simulation and Test of Digital, Analog, Mixed Mode and RF Circuits and Systems
  • Processor Design and Embedded Systems
  • VLSI, ASIC, FPGA, SoC and MPSoC
  • Computer Aided Design and Electronic Design Automation
  • Circuits and Systems for Communications
  • Power Systems and Power Electronic Circuits
  • Nonlinear Circuits and Systems
  • Control Theory Topics in Circuits and Systems
  • Signal Processing
  • Circuits and Systems for Biomedical Applications
  • Circuits and Systems for Energy Harvesting
  • Circuits and Systems for Cryptography
  • Circuits and Systems for Low Power Applications
  • Computer Aided Verification
  • Computer Aided Interconnect Analysis and Optimization
  • Circuit/Device Modeling and Simulation
  • Formal Modelling and Analysis of Circuits and Systems
  • SystemC, SystemVerilog and Transcation Level Modelling
  • Self-Correcting/Self-Healing Circuits and Systems
  • Cyber-Physical Systems
  • Battery Management Systems
  • Photovoltaic System Design

Computer Science, Software Engineering and Information Technology:

  • Formal Methods, Graph Theory, Process Algebras, Petri-Nets, Automaton Theory, BDDs and UML
  • Equivalence Checking, Model Checking, SAT-based Methods, Compositional Methods and Probabilistic Methods
  • Average-Case Analysis and Worst-Case Analysis
  • Numerical Algorithms
  • Software Developed to Solve Science
  • Computational Biology and Bioinformatics
  • Intelligent Systems
  • Internet and Web Systems
  • Real-Time, Hybrid, Embedded and Cyber-Physical Systems
  • Agent and Autonomous Systems
  • Scientific Computing and Applications
  • Computer and Information Science
  • Computer Networks and Data Communications
  • Distributed Systems, Grid Computing and Services Computing
  • Design and Programming Methodologies for Network Protocols and Applications
  • Wireless Sensor Networks
  • E-Business Design and Applications
  • Financial Mathematics
  • Financial derivative modeling and pricing
  • Financial risk management
  • Quasi-Monte Carlo methods
  • Bio-Computation
  • Computer-Aided Design and Manufacturing
  • Computer Architecture
  • Computer Control and Robotics
  • Computer Graphics, Animation, and Virtual Reality
  • Computers in Education and Learning Technologies
  • Computer Modeling and Simulations
  • Computer Security and Privacy
  • Computer Vision and Pattern Recognition

 

Paper Submissions, Proceedings, Indexing and Journal Publications

We invite the submission of high-quality and original research papers that have not been previously published and are not under review for any other conference or journal. All submissions will be peer-reviewed by at least two members of the DATICS program committee. Submissions will be evaluated on the basis of originality, significance of the contribution to the field, technical correctness and presentation.

Papers submitted for reviews may be up to 6 pages. However, the final version of accepted papers for publication allows only 4 pages. All accepted papers will be published in IEEE Xplore, which will be applied for EI Compendex/ISTP index. (Download paper template for the proceeding of IS3C2014). Papers longer than 4 pages will be charged additional USD 100 per page.

Please notice: Papers that do not follow the IEEE format requirement may be rejected by IEEE Xplore, and subsequently result in exclusion from EI&ISI index.
All submissions must be made electronically through the EasyChair online submission system at the following link: https://www.easychair.org/conferences/?conf=daticsis3c2014
 

DATICS-IS3C 2014 Review Process

DATICS-IS3C 2014 consists of about 150 experts in the related fields of DATICS both from academia and industry. Each submission will be sent to at least 2 members of the DATICS IPC and additional reviewers for review.

 

Important Dates

Paper Submission Due: January 1, 2014
Accept Notification: January 20, 2014
Camera-ready paper Due: March 25, 2014
Registration Due: February 20, 2014
Conference/Workshop Dates: June 10-12, 2014

 

 

Becoming a Sponsor of DATICS-IS3C 2014

For information, please contact info@datics.org.

 

GENERAL CHAIRS

  • Ka Lok Man, Xi'an Jiaotong-Liverpool University (China)
  • Nan Zhang, Xi'an Jiaotong-Liverpool University (China)

 

Organising Chairs

  • Michele Mercaldi, EnvEve, Switzerland
  • Chi Un Lei, University of Hong Kong
  • Tomas Krilavičius, Baltic Institute of Advanced Technologies and Vytautas Magnus University, Lithuania

 

INTERNATIONAL PROGRAM COMMITTEE

  • Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
  • Paolo Prinetto, Politecnico di Torino, Italy
  • Massimo Poncino, Politecnico di Torino, Italy
  • Alberto Macii, Politecnico di Torino, Italy
  • Joongho Choi, University of Seoul, South Korea
  • Wei Li, Fudan University, China
  • Michel Schellekens, University College Cork, Ireland
  • Emanuel Popovici, University College Cork, Ireland
  • Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
  • Umberto Rossi, STMicroelectronics, Italy
  • Franco Fummi, University of Verona, Italy
  • Graziano Pravadelli, University of Verona, Italy
  • Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong
  • Vladimir PavLov, International Software and Productivity Engineering Institute, USA
  • Ajay Patel, Intelligent Support Ltd, United Kingdom
  • Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, The Netherlands
  • Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
  • Monica Donno, Minteos, Italy
  • Jun-Dong Cho, Sung Kyun Kwan University, South Korea
  • AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
  • Gregory Provan, University College Cork, Ireland
  • Miroslav N. Velev, Aries Design Automation, USA
  • M. Nasir Uddin, Lakehead University, Canada
  • Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
  • Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
  • John Herbert, University College Cork, Ireland
  • Zhe-Ming Lu, Sun Yat-Sen University, China
  • Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
  • Chin-Chen Chang, Feng Chia University, Taiwan
  • Mong-Fong Horng, Shu-Te University, Taiwan
  • Liang Chen, University of Northern British Columbia, Canada
  • Chee-Peng Lim, University of Science Malaysia, Malaysia
  • Salah Merniz, Mentouri University, Constantine, Algeria
  • Oscar Valero, University of Balearic Islands, Spain
  • Yang Yi, Sun Yat-Sen University, China
  • Damien Woods, University of Seville, Spain
  • Franck Vedrine, CEA LIST, France
  • Bruno Monsuez, ENSTA, France
  • Kang Yen, Florida International University, USA
  • Takenobu Matsuura, Tokai University, Japan
  • R. Timothy Edwards, MultiGiG, Inc., USA
  • Olga Tveretina, Karlsruhe University, Germany
  • Maria Helena Fino, Universidade Nova De Lisboa, Portugal
  • Adrian Patrick ORiordan, University College Cork, Ireland
  • Grzegorz Labiak, University of Zielona Gora, Poland
  • Jian Chang, Texas Instruments, Inc, USA
  • Yeh-Ching Chung, National Tsing-Hua University, Taiwan
  • Anna Derezinska, Warsaw University of Technology, Poland
  • Kyoung-Rok Cho, Chungbuk National University, South Korea
  • Yuanyuan Zeng, Wuhan university, China
  • D.P. Vasudevan, University College Cork, Ireland
  • Arkadiusz Bukowiec, University of Zielona Gora, Poland
  • Maziar Goudarzi, Sharif University of Technology, Iran
  • Jin Song Dong, National University of Singapore, Singapore
  • Dhamin Al-Khalili, Royal Military College of Canada, Canada
  • Zainalabedin Navabi, University of Tehran, Iran
  • Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
  • Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan
  • Deepak Laxmi Narasimha, University of Malaya, Malaysia
  • Danny Hughes, Katholieke Universiteit Leuven, Belgium
  • Jun Wang, Fujitsu Laboratories of America, Inc., USA
  • A.P. Sathish Kumar, PSG Institute of Advanced Studies, India
  • N. Jaisankar, VIT University. India
  • Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan
  • Steven Hollands, Synopsys, Ireland
  • Siamak Mohammadi, University of Tehran, Iran
  • Felipe Klein, State University of Campinas (UNICAMP), Brazil
  • Enggee Lim, Xi'an Jiaotong-Liverpool University, China
  • Kevin Lee, Murdoch University, Australia
  • Prabhat Mahanti, University of New Brunswick, Saint John, Canada
  • Kaiyu Wan, Xi'an Jiaotong-Liverpool University, China
  • Tammam Tillo, Xi'an Jiaotong-Liverpool University, China
  • Yanyan Wu, Xi'an Jiaotong-Liverpool University, China
  • Wen Chang Huang, Kun Shan University, Taiwan
  • Masahiro Sasaki, The University of Tokyo, Japan
  • Shishir K. Shandilya, NRI Institute of Information Science & Technology, India
  • J.P.M. Voeten, Eindhoven University of Technology, The Netherlands
  • Wichian Sittiprapaporn, Mahasarakham University, Thailand
  • Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA
  • Kevin Marquet, Verimag Laboratory, France
  • Matthieu Moy, Verimag Laboratory, France
  • Ramy Iskander, LIP6 Laboratory, France
  • Suryaprasad Jayadevappa, PES School of Engineering, India
  • Shanmugasundaram Hariharan, Pavendar Bharathidasan College of Engineering and Technology, India
  • Chung-Ho Chen, National Cheng-Kung University, Taiwan
  • Kyung Ki Kim, Daegu University, Korea
  • Shiho Kim, Chungbuk National University, Korea
  • Hi Seok Kim, Cheongju University, Korea
  • Brian Logan, University of Nottingham, UK
  • Asoke Nath, St. Xavier's College (Autonomous), India
  • Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand
  • Shin-Ya Takahasi, Fukuoka University, Japan
  • Cheng C. Liu, University of Wisconsin at Stout, USA
  • Farhan Siddiqui, Walden University, Minneapolis, USA
  • Katsumi Wasaki, Shinshu University, Japan
  • Pankaj Gupta, Microsoft Corporation, USA
  • Taikyeong Jeong, Myongji University, South Korea
  • Masoud Daneshtalab, University of Turku, Finland
  • Amit Chaudhry, Technology Panjab University, India
  • Bharat Bhushan Agarwal, I.F.T.M., University, India
  • Abhilash Goyal, Oracle (SunMicrosystems), USA
  • Boguslaw Cyganek, AGH University of Science and Technology, Poland
  • Yeo Kiat Seng, Nanyang Technological University, Singapore
  • Youngmin Kim, UNIST Academy-Industry Research Corporation, South Korea
  • Tom English, Xlinx, Ireland
  • Nicolas Vallee, RATP, France
  • Mou Ling Dennis Wong, Xi'an Jiatong Liverpool University, China
  • Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA
  • Xuan Guan, Freescale Semiconductor, Austin, TX, USA
  • Pradip Kumar Sadhu, Indian School of Mines, India
  • Fei Qiao, Tsinghua University, China
  • Chao Lu, Purdue University, USA
  • Ding-Yuan Cheng, National Chiao Tung University, Taiwan
  • Pradeep Sharma, IEC College of Engineering & Technology, Greater Noida, GB Nagar UP, India
  • Ausra Vidugiriene, Vytautas Magnus University, Lithuania
  • Sheung-Hung Poon, National Tsing Hua University, Taiwan
  • Lixin Cheng, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
  • Yue Yang, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
  • Yo-Sub Han, Yonsei University, South Korea
  • Chien-Chang Chen, Tamkang University, Taiwan
  • Hui-huang Hsu, Tamkang University, Taiwan
  • Hwann-Tzong Chen, National Tsing Hua University, Taiwan

 

INTERNATIONAL REVIEWERS

  • Miquel Moreto Planas, Technical University of Catalonia, Spain
  • Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
  • Luigi Giancardi, Devoteam auSystems SpA, Italy
  • Alie El-Din Mady, University College Cork, Ireland
  • Prasad D. Khandekar Vishwakarma Institute of Information Technology, Pune
  • Hari Mohan Pandey, SVKM's NMIMS University, India
  • Vishal Bharti, Dronacharya College of Engineering, Khentawas, Gurgaon, India
  • Yiwang Wang, Suzhou Vocational University, China
  • Pavan Kumar Manchikalapudi, MNNIT, India
  • Puneet Sareen, Texas Instruments, Germany
  • Ben L Zhou, Tabula, USA
  • Razan Paul, Bangladesh University of Engineering and Technology, Bangladesh
  • Farakh Javid, LIP6 Laboratory, France
  • Sushil Menon, PES School of Engineering, India
  • Khalid Latif, University of Turku, Finland
  • Masoumeh Ebrahimi, University of Turku, Finland
  • Chi-Hua Chen, National Chiao Tung University, Taiwan

 

Technical Committee and DATICS Group

If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to info@datics.org.


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