DATICS-IMECS 2017

DATICS Workshops were initially created by a network of researchers and engineers both from academia and industry in the areas of Design, Analysis and Tools for Integrated Circuits and Systems. Recently, DATICS has been extended to the fields of Communication, Computer Science, Software Engineering and Information Technology. The main target of DATICS-IMECS 2017 is to bring together software/hardware engineering researchers, computer scientists, practitioners and people from industry to exchange theories, ideas, techniques and experiences related to all aspects of DATICS.

DATICS-IMECS 2017 will be hosted by the International MultiConference of Engineers and Computer Scientists 2017 (IMECS 2017 http://www.iaeng.org/IMECS2017) and takes place in Hong Kong 15-17 March, 2017.

 

TOPICS

Topics of interest include, but are not limited to, the following:

Circuits, Systems and Communications:

  • Design, Simulation and Test of Digital, Analog, Mixed Mode and RF Circuits and Systems
  • Processor Design and Embedded Systems
  • VLSI, ASIC, FPGA, SoC and MPSoC
  • Computer Aided Design and Electronic Design Automation
  • Circuits and Systems for Communications
  • Power Systems and Power Electronic Circuits
  • Nonlinear Circuits and Systems
  • Control Theory Topics in Circuits and Systems
  • Signal Processing
  • Circuits and Systems for Biomedical Applications
  • Circuits and Systems for Energy Harvesting
  • Circuits and Systems for Cryptography
  • Circuits and Systems for Low Power Applications
  • Computer Aided Verification
  • Computer Aided Interconnect Analysis and Optimization
  • Circuit/Device Modeling and Simulation
  • Formal Modelling and Analysis of Circuits and Systems
  • SystemC, SystemVerilog and Transcation Level Modelling
  • Self-Correcting/Self-Healing Circuits and Systems
  • Cyber-Physical Systems
  • Battery Management Systems
  • Photovoltaic System Design

Computer Science, Software Engineering and Information Technology:

  • Formal Methods, Graph Theory, Process Algebras, Petri-Nets, Automaton Theory, BDDs and UML
  • Equivalence Checking, Model Checking, SAT-based Methods, Compositional Methods and Probabilistic Methods
  • Average-Case Analysis and Worst-Case Analysis
  • Numerical Algorithms
  • Software Developed to Solve Science
  • Computational Biology and Bioinformatics
  • Intelligent Systems
  • Internet and Web Systems
  • Real-Time, Hybrid, Embedded and Cyber-Physical Systems
  • Agent and Autonomous Systems
  • Scientific Computing and Applications
  • Computer and Information Science
  • Computer Networks and Data Communications
  • Distributed Systems, Grid Computing and Services Computing
  • Design and Programming Methodologies for Network Protocols and Applications
  • Wireless Sensor Networks
  • E-Business Design and Applications
  • Financial Mathematics
  • Computer-Aided Design and Manufacturing
  • Computer Architecture
  • Computer Control and Robotics
  • Computer Graphics, Animation, and Virtual Reality
  • Computers in Education and Learning Technologies
  • Computer Modeling and Simulations
  • Computer Security and Privacy
  • Computer Vision and Pattern Recognition

 

Paper Submissions, Proceedings, Indexing and Journal Publications

All submitted papers should be in the form of .pdf and are to be limited to a maximum length of 6 pages (A4 size, single space, Times Roman of font size 10, two columns format), including figures, tables and references. There is no template for the initial paper. Please submit full papers using the EasyChair DATICS-IMECS 2017 Webpage at https://easychair.org/conferences/?conf=daticsimecs2017.


If the paper(s) is/are accepted for publication, at least one of the authors of the accepted paper(s) must register to the DATICS-IMECS 2017 Workshop through the hosting conference IMECS 2017. Details of the registration can be found at http://www.iaeng.org/IMECS2017/registration.html .


Please note that the accepted papers in DATICS-IMECS 2017 will be indexed in major database indexes so that it can be assess easily. After publication of the proceedings, print copies will be sent to databases like IET INSPEC, EBSCO, ISI Thomson Scientific, Engineering Index (EI),The Technology Research Databases (TRD) of CSA (Cambridge Scientific Abstracts), DBLP and Computer Science Bibliographies for indexing.


Expanded and enhanced versions of accepted papers in DATICS-IMECS 2017 can also be considered for inclusion in the IJDATICS journal (http://ijdatics.datics.net/) and Special Issues of the of International Journals of Symmetry (indexed by SCIE - http://www.mdpi.com/journal/symmetry), Sensors (indexed by SCIE - http://www.mdpi.com/journal/sensors), Low Power Electronics and Applications (indexed by IET and Scopus - http://www.mdpi.com/journal/jlpea) and Advanced Computer Science and Applications (indexed by ESCI -http://thesai.org/Publications). 

 

  

          International Journal of Advanced Computer Science and Applications

 

SPECIAL ISSUES FOR DATICS WORKSHOPS IN 2017

 

DATICS-IMECS 2017 Review Process

DATICS-IMECS 2017 consists of about 150 experts in the related fields of DATICS both from academia and industry. Each submission will be sent to at least 2 members of the DATICS IPC and additional reviewers for review.

 

Important Dates

  • Draft Manuscript Submission Deadline: 8 December, 2016
  • Camera-Ready Papers Due & Registration Deadline: 10 January, 2017
  • IMECS 2017: 15-17 March, 2017

 

Becoming a Sponsor of DATICS-IMECS 2017

For information, please contact info@datics.org.

 

GENERAL CHAIRS

  • Ka Lok Man, Xi'an Jiaotong-Liverpool University (China)
  • Tomas Krilavičius, Baltic Institute of Advanced Technologies and Vytautas Magnus University (Lithuania)
  • Seungmin Rho, Sungkyul University (Republic of Korea)

 

GENERAL CO-CHAIRS

 

INTERNATIONAL PROGRAM COMMITTEE

  • Vladimir Hahanov, Kharkov National University of Radio Electronics, Ukraine
  • Paolo Prinetto, Politecnico di Torino, Italy
  • Massimo Poncino, Politecnico di Torino, Italy
  • Alberto Macii, Politecnico di Torino, Italy
  • Joongho Choi, University of Seoul, South Korea
  • Wei Li, Fudan University, China
  • Michel Schellekens, University College Cork, Ireland
  • Emanuel Popovici, University College Cork, Ireland
  • Jong-Kug Seon, System LSI Lab., LS Industrial Systems R&D Center, South Korea
  • Umberto Rossi, STMicroelectronics, Italy
  • Franco Fummi, University of Verona, Italy
  • Graziano Pravadelli, University of Verona, Italy
  • Yui Fai Lam, Hong Kong University of Science and Technology, Hong Kong
  • Vladimir PavLov, International Software and Productivity Engineering Institute, USA
  • Ajay Patel, Intelligent Support Ltd, United Kingdom
  • Jinfeng Huang, Philips & LiteOn Digital Solutions Netherlands, The Netherlands
  • Thierry Vallee, Georgia Southern University, Statesboro, Georgia, USA
  • Monica Donno, Minteos, Italy
  • Jun-Dong Cho, Sung Kyun Kwan University, South Korea
  • AHM Zahirul Alam, International Islamic University Malaysia, Malaysia
  • Gregory Provan, University College Cork, Ireland
  • Miroslav N. Velev, Aries Design Automation, USA
  • M. Nasir Uddin, Lakehead University, Canada
  • Dragan Bosnacki, Eindhoven University of Technology, The Netherlands
  • Milan Pastrnak, Siemens IT Solutions and Services, Slovakia
  • John Herbert, University College Cork, Ireland
  • Zhe-Ming Lu, Sun Yat-Sen University, China
  • Jeng-Shyang Pan, National Kaohsiung University of Applied Sciences, Taiwan
  • Chin-Chen Chang, Feng Chia University, Taiwan
  • Mong-Fong Horng, Shu-Te University, Taiwan
  • Liang Chen, University of Northern British Columbia, Canada
  • Chee-Peng Lim, University of Science Malaysia, Malaysia
  • Salah Merniz, Mentouri University, Constantine, Algeria
  • Oscar Valero, University of Balearic Islands, Spain
  • Yang Yi, Sun Yat-Sen University, China
  • Damien Woods, University of Seville, Spain
  • Franck Vedrine, CEA LIST, France
  • Bruno Monsuez, ENSTA, France
  • Kang Yen, Florida International University, USA
  • Takenobu Matsuura, Tokai University, Japan
  • R. Timothy Edwards, MultiGiG, Inc., USA
  • Olga Tveretina, Karlsruhe University, Germany
  • Maria Helena Fino, Universidade Nova De Lisboa, Portugal
  • Adrian Patrick ORiordan, University College Cork, Ireland
  • Grzegorz Labiak, University of Zielona Gora, Poland
  • Jian Chang, Texas Instruments, Inc, USA
  • Yeh-Ching Chung, National Tsing-Hua University, Taiwan
  • Anna Derezinska, Warsaw University of Technology, Poland
  • Kyoung-Rok Cho, Chungbuk National University, South Korea
  • Yuanyuan Zeng, Wuhan university, China
  • D.P. Vasudevan, University College Cork, Ireland
  • Arkadiusz Bukowiec, University of Zielona Gora, Poland
  • Maziar Goudarzi, Sharif University of Technology, Iran
  • Jin Song Dong, National University of Singapore, Singapore
  • Dhamin Al-Khalili, Royal Military College of Canada, Canada
  • Zainalabedin Navabi, University of Tehran, Iran
  • Lyudmila Zinchenko, Bauman Moscow State Technical University, Russia
  • Muhammad Almas Anjum, National University of Sciences and Technology (NUST), Pakistan
  • Deepak Laxmi Narasimha, University of Malaya, Malaysia
  • Danny Hughes, Katholieke Universiteit Leuven, Belgium
  • Jun Wang, Fujitsu Laboratories of America, Inc., USA
  • A.P. Sathish Kumar, PSG Institute of Advanced Studies, India
  • N. Jaisankar, VIT University. India
  • Atif Mansoor, National University of Sciences and Technology (NUST), Pakistan
  • Steven Hollands, Synopsys, Ireland
  • Siamak Mohammadi, University of Tehran, Iran
  • Felipe Klein, State University of Campinas (UNICAMP), Brazil
  • Enggee Lim, Xi'an Jiaotong-Liverpool University, China
  • Kevin Lee, Murdoch University, Australia
  • Prabhat Mahanti, University of New Brunswick, Saint John, Canada
  • Kaiyu Wan, Xi'an Jiaotong-Liverpool University, China
  • Tammam Tillo, Xi'an Jiaotong-Liverpool University, China
  • Yanyan Wu, Xi'an Jiaotong-Liverpool University, China
  • Wen Chang Huang, Kun Shan University, Taiwan
  • Masahiro Sasaki, The University of Tokyo, Japan
  • Shishir K. Shandilya, NRI Institute of Information Science & Technology, India
  • J.P.M. Voeten, Eindhoven University of Technology, The Netherlands
  • Wichian Sittiprapaporn, Mahasarakham University, Thailand
  • Aseem Gupta, Freescale Semiconductor Inc., Austin, TX, USA
  • Kevin Marquet, Verimag Laboratory, France
  • Matthieu Moy, Verimag Laboratory, France
  • Ramy Iskander, LIP6 Laboratory, France
  • Suryaprasad Jayadevappa, PES School of Engineering, India
  • Shanmugasundaram Hariharan, Pavendar Bharathidasan College of Engineering and Technology, India
  • Chung-Ho Chen, National Cheng-Kung University, Taiwan
  • Kyung Ki Kim, Daegu University, Korea
  • Shiho Kim, Chungbuk National University, Korea
  • Hi Seok Kim, Cheongju University, Korea
  • Brian Logan, University of Nottingham, UK
  • Asoke Nath, St. Xavier's College (Autonomous), India
  • Tharwon Arunuphaptrairong, Chulalongkorn University, Thailand
  • Shin-Ya Takahasi, Fukuoka University, Japan
  • Cheng C. Liu, University of Wisconsin at Stout, USA
  • Farhan Siddiqui, Walden University, Minneapolis, USA
  • Katsumi Wasaki, Shinshu University, Japan
  • Pankaj Gupta, Microsoft Corporation, USA
  • Taikyeong Jeong, Myongji University, South Korea
  • Masoud Daneshtalab, University of Turku, Finland
  • Amit Chaudhry, Technology Panjab University, India
  • Bharat Bhushan Agarwal, I.F.T.M., University, India
  • Abhilash Goyal, Oracle (SunMicrosystems), USA
  • Boguslaw Cyganek, AGH University of Science and Technology, Poland
  • Yeo Kiat Seng, Nanyang Technological University, Singapore
  • Youngmin Kim, UNIST Academy-Industry Research Corporation, South Korea
  • Tom English, Xlinx, Ireland
  • Nicolas Vallee, RATP, France
  • Rajeev Narayanan, Cadence Design Systems, Austin, TX, USA
  • Xuan Guan, Freescale Semiconductor, Austin, TX, USA
  • Pradip Kumar Sadhu, Indian School of Mines, India
  • Fei Qiao, Tsinghua University, China
  • Chao Lu, Purdue University, USA
  • Ding-Yuan Cheng, National Chiao Tung University, Taiwan
  • Pradeep Sharma, IEC College of Engineering & Technology, Greater Noida, GB Nagar UP, India
  • Ausra Vidugiriene, Vytautas Magnus University, Lithuania
  • Sheung-Hung Poon, National Tsing Hua University, Taiwan
  • Lixin Cheng, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
  • Yue Yang, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), Chinese Academy of Sciences, China
  • Yo-Sub Han, Yonsei University, South Korea
  • Chien-Chang Chen, Tamkang University, Taiwan
  • Hui-huang Hsu, Tamkang University, Taiwan
  • Hwann-Tzong Chen, National Tsing Hua University, Taiwan
  • Michele Mercaldi, EnvEve, Switzerland
  • Chi Un Lei, University of Hong Kong

 

INTERNATIONAL REVIEWERS

  • Miquel Moreto Planas, Technical University of Catalonia, Spain
  • Chelho Chung, System Semiconductor/Central R&D Center, LS Industrial Systems, South Korea
  • Luigi Giancardi, Devoteam auSystems SpA, Italy
  • Alie El-Din Mady, University College Cork, Ireland
  • Prasad D. Khandekar Vishwakarma Institute of Information Technology, Pune
  • Hari Mohan Pandey, SVKM's NMIMS University, India
  • Vishal Bharti, Dronacharya College of Engineering, Khentawas, Gurgaon, India
  • Yiwang Wang, Suzhou Vocational University, China
  • Pavan Kumar Manchikalapudi, MNNIT, India
  • Puneet Sareen, Texas Instruments, Germany
  • Ben L Zhou, Tabula, USA
  • Razan Paul, Bangladesh University of Engineering and Technology, Bangladesh
  • Farakh Javid, LIP6 Laboratory, France
  • Sushil Menon, PES School of Engineering, India
  • Khalid Latif, University of Turku, Finland
  • Masoumeh Ebrahimi, University of Turku, Finland
  • Chi-Hua Chen, National Chiao Tung University, Taiwan

 

Web manager

  • David Afolabi, Xi'an Jiaotong-Liverpool University (China) 

Technical Committee and DATICS Group

If you are interested in joining the DATICS International Program Committee and Reviewers, please submit a brief CV by email to info@datics.org.


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